JPS6241594Y2 - - Google Patents
Info
- Publication number
- JPS6241594Y2 JPS6241594Y2 JP1980156727U JP15672780U JPS6241594Y2 JP S6241594 Y2 JPS6241594 Y2 JP S6241594Y2 JP 1980156727 U JP1980156727 U JP 1980156727U JP 15672780 U JP15672780 U JP 15672780U JP S6241594 Y2 JPS6241594 Y2 JP S6241594Y2
- Authority
- JP
- Japan
- Prior art keywords
- transistor
- voltage
- switching transistor
- output
- metal substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 45
- 239000003990 capacitor Substances 0.000 claims description 27
- 239000002184 metal Substances 0.000 claims description 27
- 230000003321 amplification Effects 0.000 claims description 24
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 24
- 238000001514 detection method Methods 0.000 claims description 10
- 238000004804 winding Methods 0.000 description 21
- 239000000919 ceramic Substances 0.000 description 16
- 230000007423 decrease Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/4901—Structure
- H01L2224/4903—Connectors having different sizes, e.g. different diameters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Continuous-Control Power Sources That Use Transistors (AREA)
- Dc-Dc Converters (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980156727U JPS6241594Y2 (en]) | 1980-10-31 | 1980-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980156727U JPS6241594Y2 (en]) | 1980-10-31 | 1980-10-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5780187U JPS5780187U (en]) | 1982-05-18 |
| JPS6241594Y2 true JPS6241594Y2 (en]) | 1987-10-24 |
Family
ID=29515870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980156727U Expired JPS6241594Y2 (en]) | 1980-10-31 | 1980-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6241594Y2 (en]) |
-
1980
- 1980-10-31 JP JP1980156727U patent/JPS6241594Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5780187U (en]) | 1982-05-18 |
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